英特尔将合并四大部门,布局移动通信领域

上网时间: 2011年12月16日? 作者:Sylvie Barak? 我来评论 【字号: ? ?小】

关键字:英特尔移动通信部门? 合并? intel芯片集成无线基带?

Intel announces mobile, wireless reorganization

Sylvie Barak

MOUNTAIN VIEW, Calif--In a bid to tighten and hone its mobile technology focus, Intel Corp. has confirmed it has reorganized several business units to form a new mobile and communications group which will be responsible for all the firm’s smartphone, tablet and wireless communication efforts.

The reorganization fuses together the mobile communications, netbook/tablet, mobile wireless and ultra-mobility business units into one group headed by former Palm executive Mike Bell and former Infineon Wireless chief Hermann Eul.

A spokesperson said Intel was looking to “speed up and improve development of Intel-based mobile devices,” from streamlining the software development efforts for tablets and phones to fine tuning the SoCs for mobile usage.

Back in March 2011, Intel announced that Anand Chandraskher, GM of the former ultra-mobility group, would be leaving the company to "pursue other interests," with many analysts positing that he had been ousted for failing to deliver on Intel’s long held mobile aspirations.

An Intel spokesman said Bell and Eul’s role would be bigger than Chandraskher’s, with the pair boasting numerous years of wireless industry experience between them.

Though Palm was never a big player in the mobile market, Bell also has previous experience at Apple Inc. where he worked on the Macintosh and the early iPhone model. Eul, on the other hand, will be instrumental to helping Intel integrate wireless baseband onto its Atom chips, putting the firm in direct competition with rival Qualcomm.

It’s generally believed that Atom products with integrated baseband could emerge within the next two years.

Intel has said publicly it hopes to have a viable smartphone offering on the market within the first half of 2012, and has made much of its partnership with Google for Android x86 development. Whether Intel’s engineers are able to reduce Atom power levels significantly enough to compete seriously with ARM’s chip architecture, however, remains to be seen.


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